Semiconductor Wafer Polisher from China
Chemical mechanical polishing (CMP) tool that disperses polishing slurry to planarize wafer surfaces for circuit fabrication. HTS 8424.89.9000 includes such liquid projecting apparatus for semiconductor wafer preparation.
Duty Rate — China → United States
36.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Submit CMP process recipes showing slurry projection to validate classification
• Declare pad conditioning system separately if modular; prevents set classification