Semiconductor Wafer Polisher from Japan
Chemical mechanical polishing (CMP) tool that disperses polishing slurry to planarize wafer surfaces for circuit fabrication. HTS 8424.89.9000 includes such liquid projecting apparatus for semiconductor wafer preparation.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Submit CMP process recipes showing slurry projection to validate classification
• Declare pad conditioning system separately if modular; prevents set classification