Nanoparticle Slurry Disperser for STI CMP
High-pressure disperser projecting ceria nanoparticle slurry for shallow trench isolation chemical mechanical polishing. Classified HTS 8424.89.9000 for powder/liquid dispersion in semiconductor planarization.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | +40.0% | 40% |
| 🇲🇽Mexico | Free | +15.0% | 15% |
| 🇨🇦Canada | Free | +15.0% | 15% |
| 🇩🇪Germany | Free | +15.0% | 15% |
| 🇯🇵Japan | Free | +15.0% | 15% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If mixing apparatus for semiconductor slurries
Slurry mixing/kneading equipment classifies in dedicated 8479 provisions.
If powder spraying nozzles
Nanopowder delivery nozzles without mixing classify as spray nozzles.
If prepared chemical slurry products
Chemical composition may supersede machinery classification for consumables.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide zeta potential and particle size distribution data for slurry
• Classify point-of-use mixing with storage tanks as complete system
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