Nanoparticle Slurry Disperser for STI CMP from China
High-pressure disperser projecting ceria nanoparticle slurry for shallow trench isolation chemical mechanical polishing. Classified HTS 8424.89.9000 for powder/liquid dispersion in semiconductor planarization.
Duty Rate — China → United States
36.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Provide zeta potential and particle size distribution data for slurry
• Classify point-of-use mixing with storage tanks as complete system