Mixing, kneading, crushing, grinding, screening, sifting, homogenizing, emulsifying or stirring machines
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Other machines and mechanical appliances: > Mixing, kneading, crushing, grinding, screening, sifting, homogenizing, emulsifying or stirring machines
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8479.82.00
Czochralski Crystal Puller
A specialized machine used in semiconductor manufacturing to grow monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon using the Czochralski method. It falls under HTS 8479.82.00 as a mixing or stirring machine due to the precise stirring and homogenization of the melt to ensure crystal purity and uniformity.
Float Zone Crystal Grower
Equipment that uses the float zone method to purify and grow semiconductor crystals by melting a narrow zone of polycrystalline silicon with RF heating while moving it along the rod. Classified under HTS 8479.82.00 for its stirring and homogenizing action in zone refining to achieve ultra-pure monocrystalline silicon.
Semiconductor Wafer Grinding Machine
Precision grinder that processes semiconductor wafers sliced from crystal boules, grinding to exact diameter and creating orientation flats indicating conductivity type. It qualifies under HTS 8479.82.00 as grinding equipment specifically for semiconductor preparation per statistical notes.
Crystal Boule Grinder
Machine that grinds semiconductor crystal boules to precise diameters required for standard wafer production and etches flats for resistivity indication. Falls under HTS 8479.82.00 as grinding apparatus for semiconductor material processing as defined in statistical notes.
Wafer Lapping Machine
Precision lapping equipment that achieves sub-micron flatness on semiconductor wafers by abrading with loose abrasive slurry on a rotating plate. Classified in HTS 8479.82.00 for grinding/lapping functions in wafer preparation for device fabrication.
Semiconductor Wafer Polisher
Double-sided polishing machine that creates mirror-finish surfaces on semiconductor wafers critical for subsequent fabrication processes. Under HTS 8479.82.00 as polishing equipment for wafer surface preparation per chapter statistical notes.
Industrial Dough Kneader
High-capacity spiral mixer that kneads large batches of dough for commercial bakery production through intensive mechanical working. Classified under HTS 8479.82.00 specifically for its kneading function not covered elsewhere in Chapter 84.
Pharmaceutical Homogenizer
High-pressure homogenizer that creates stable emulsions for pharmaceutical creams and suspensions by forcing product through narrow gaps at 1000+ bar. Falls under HTS 8479.82.00 for emulsifying function essential to drug formulation.
Paint Emulsifying Mixer
High-shear rotor-stator mixer that emulsifies pigments into water-based paints creating stable dispersions. Classified HTS 8479.82.00 for emulsifying machines used in paint and coating production.
Chemical Powder Blender
Ribbon blender that homogeneously mixes dry chemical powders through helical ribbon agitation for consistent batch composition. Under HTS 8479.82.00 as a homogenizing machine for industrial chemical processing.