Semiconductor Wafer Grinding Machine
Precision grinder that processes semiconductor wafers sliced from crystal boules, grinding to exact diameter and creating orientation flats indicating conductivity type. It qualifies under HTS 8479.82.00 as grinding equipment specifically for semiconductor preparation per statistical notes.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If adaptable for general metal or glass grinding
Lack of semiconductor-specific precision features shifts to honing/grinding machines of heading 8460.
If manual lab-scale grinders under 1.5m grinding length
Small-scale optical grinding equipment for other materials falls under Chapter 90.
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Import Tips & Compliance
• Submit SEMI standards compliance certificates to prove semiconductor-specific tolerances (e.g
• <1 micron flatness)
• Document integration with wafer slicing lines to establish processing equipment status
Related Products under HTS 8479.82.00
Czochralski Crystal Puller
A specialized machine used in semiconductor manufacturing to grow monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon using the Czochralski method. It falls under HTS 8479.82.00 as a mixing or stirring machine due to the precise stirring and homogenization of the melt to ensure crystal purity and uniformity.
Float Zone Crystal Grower
Equipment that uses the float zone method to purify and grow semiconductor crystals by melting a narrow zone of polycrystalline silicon with RF heating while moving it along the rod. Classified under HTS 8479.82.00 for its stirring and homogenizing action in zone refining to achieve ultra-pure monocrystalline silicon.
Crystal Boule Grinder
Machine that grinds semiconductor crystal boules to precise diameters required for standard wafer production and etches flats for resistivity indication. Falls under HTS 8479.82.00 as grinding apparatus for semiconductor material processing as defined in statistical notes.
Wafer Lapping Machine
Precision lapping equipment that achieves sub-micron flatness on semiconductor wafers by abrading with loose abrasive slurry on a rotating plate. Classified in HTS 8479.82.00 for grinding/lapping functions in wafer preparation for device fabrication.
Semiconductor Wafer Polisher
Double-sided polishing machine that creates mirror-finish surfaces on semiconductor wafers critical for subsequent fabrication processes. Under HTS 8479.82.00 as polishing equipment for wafer surface preparation per chapter statistical notes.
Industrial Dough Kneader
High-capacity spiral mixer that kneads large batches of dough for commercial bakery production through intensive mechanical working. Classified under HTS 8479.82.00 specifically for its kneading function not covered elsewhere in Chapter 84.