8479.82.00/Semiconductor Wafer Grinding Machine/Japan

Semiconductor Wafer Grinding Machine from Japan

Precision grinder that processes semiconductor wafers sliced from crystal boules, grinding to exact diameter and creating orientation flats indicating conductivity type. It qualifies under HTS 8479.82.00 as grinding equipment specifically for semiconductor preparation per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit SEMI standards compliance certificates to prove semiconductor-specific tolerances (e.g

• <1 micron flatness)

• Document integration with wafer slicing lines to establish processing equipment status