Other
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Other machines and mechanical appliances: > Mixing, kneading, crushing, grinding, screening, sifting, homogenizing, emulsifying or stirring machines > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8479.82.00.80
Silicon Ingot Slicing Saw
High-precision inner diameter (ID) saw for slicing semiconductor ingots into thin wafers with minimal material loss. Classified under 8479.82.0080 as wafer manufacturing slicing equipment.
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon in the Czochralski process. It falls under HTS 8479.82.0080 as specialized grinding and processing equipment for semiconductor wafer manufacturing not classified elsewhere.
Float Zone Crystal Grower
Equipment employing the float zone method to refine and grow high-purity silicon crystals by melting a narrow zone of polycrystalline rod without a crucible. Classified in 8479.82.0080 for semiconductor-specific grinding and homogenization processes.
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity type. Meets 8479.82.0080 as wafer preparation grinding equipment per statistical notes.
Semiconductor Wafer Lapping Machine
Machine that lap semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. Falls under 8479.82.0080 as specialized wafer preparation grinding equipment.
Wafer Edge Grinding Machine
Specialized grinder for creating precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. Classified 8479.82.0080 for semiconductor wafer preparation grinding.
Diamond Wafer Polishing System
Chemical mechanical polishing (CMP) system using diamond abrasives to achieve mirror finish on semiconductor wafers for device fabrication. 8479.82.0080 as specialized wafer grinding/polishing apparatus.
Gallium Arsenide Wafer Grinder
Specialized grinder for compound semiconductor wafers like GaAs, handling brittle materials with unique back-grinding requirements. 8479.82.0080 per statistical notes for semiconductor processing.
Crystal Orientation Grinder
Grinding machine that precisely orients semiconductor crystal flats to crystallographic planes for device fabrication. Essential wafer preparation step under 8479.82.0080.
Double-Sided Wafer Lapper
Simultaneous double-sided lapping machine for semiconductor wafers achieving uniform thickness across entire wafer surface. 8479.82.0080 specialized grinding equipment.