Double-Sided Wafer Lapper
Simultaneous double-sided lapping machine for semiconductor wafers achieving uniform thickness across entire wafer surface. 8479.82.0080 specialized grinding equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If single-side precision grinding
Processing method determines grinding classification.
If primarily filtering function
Slurry system dominance changes classification.
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Import Tips & Compliance
• Document total thickness variation (TTV <1μm) specifications
• Include carrier plate design and pressure control details
Related Products under HTS 8479.82.00.80
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High-precision inner diameter (ID) saw for slicing semiconductor ingots into thin wafers with minimal material loss. Classified under 8479.82.0080 as wafer manufacturing slicing equipment.
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon in the Czochralski process. It falls under HTS 8479.82.0080 as specialized grinding and processing equipment for semiconductor wafer manufacturing not classified elsewhere.
Float Zone Crystal Grower
Equipment employing the float zone method to refine and grow high-purity silicon crystals by melting a narrow zone of polycrystalline rod without a crucible. Classified in 8479.82.0080 for semiconductor-specific grinding and homogenization processes.
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity type. Meets 8479.82.0080 as wafer preparation grinding equipment per statistical notes.
Semiconductor Wafer Lapping Machine
Machine that lap semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. Falls under 8479.82.0080 as specialized wafer preparation grinding equipment.
Wafer Edge Grinding Machine
Specialized grinder for creating precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. Classified 8479.82.0080 for semiconductor wafer preparation grinding.