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8479.82.00.80/Double-Sided Wafer Lapper/Japan

Double-Sided Wafer Lapper from Japan

Simultaneous double-sided lapping machine for semiconductor wafers achieving uniform thickness across entire wafer surface. 8479.82.0080 specialized grinding equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document total thickness variation (TTV <1μm) specifications

• Include carrier plate design and pressure control details

Double-Sided Wafer Lapper from Japan — Import Duty Rate | HTS 8479.82.00.80