</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8479.82.00.80/Double-Sided Wafer Lapper/Germany

Double-Sided Wafer Lapper from Germany

Simultaneous double-sided lapping machine for semiconductor wafers achieving uniform thickness across entire wafer surface. 8479.82.0080 specialized grinding equipment.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Calculate with your customs valueVerify classification with AI

Import Tips

• Document total thickness variation (TTV <1μm) specifications

• Include carrier plate design and pressure control details

Double-Sided Wafer Lapper from Germany — Import Duty Rate | HTS 8479.82.00.80