Double-Sided Wafer Lapper from Canada
Simultaneous double-sided lapping machine for semiconductor wafers achieving uniform thickness across entire wafer surface. 8479.82.0080 specialized grinding equipment.
Duty Rate — Canada → United States
60%
Rate breakdown
9903.03.1450%Articles the product of Canada as provided in subdivision (b)(3) of U.S. note 51 to this subchapter
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document total thickness variation (TTV <1μm) specifications
• Include carrier plate design and pressure control details