Double-Sided Wafer Lapper from Mexico
Simultaneous double-sided lapping machine for semiconductor wafers achieving uniform thickness across entire wafer surface. 8479.82.0080 specialized grinding equipment.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document total thickness variation (TTV <1μm) specifications
• Include carrier plate design and pressure control details