Crystal Orientation Grinder
Grinding machine that precisely orients semiconductor crystal flats to crystallographic planes for device fabrication. Essential wafer preparation step under 8479.82.0080.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If without crystal orientation capability
Specialized metrology function changes classification.
If integrated X-ray diffractometer
Measuring instrument components classified in Chapter 90.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Include angular precision specs (±0.5° typical) and X-ray diffraction capability
• Specify flat position standards (JEDEC or SEMI)
Related Products under HTS 8479.82.00.80
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Float Zone Crystal Grower
Equipment employing the float zone method to refine and grow high-purity silicon crystals by melting a narrow zone of polycrystalline rod without a crucible. Classified in 8479.82.0080 for semiconductor-specific grinding and homogenization processes.
Crystal Boule Grinder
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Semiconductor Wafer Lapping Machine
Machine that lap semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. Falls under 8479.82.0080 as specialized wafer preparation grinding equipment.
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Specialized grinder for creating precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. Classified 8479.82.0080 for semiconductor wafer preparation grinding.