8479.82.00.80/Crystal Orientation Grinder/Japan

Crystal Orientation Grinder from Japan

Grinding machine that precisely orients semiconductor crystal flats to crystallographic planes for device fabrication. Essential wafer preparation step under 8479.82.0080.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include angular precision specs (±0.5° typical) and X-ray diffraction capability

• Specify flat position standards (JEDEC or SEMI)