8479.82.00.80/Crystal Orientation Grinder/Japan

Crystal Orientation Grinder from Japan

Grinding machine that precisely orients semiconductor crystal flats to crystallographic planes for device fabrication. Essential wafer preparation step under 8479.82.0080.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Include angular precision specs (±0.5° typical) and X-ray diffraction capability

• Specify flat position standards (JEDEC or SEMI)