Crystal Orientation Grinder from Germany
Grinding machine that precisely orients semiconductor crystal flats to crystallographic planes for device fabrication. Essential wafer preparation step under 8479.82.0080.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include angular precision specs (±0.5° typical) and X-ray diffraction capability
• Specify flat position standards (JEDEC or SEMI)