Wafer Lapping Machine
Machine that projects abrasive slurry onto rotating lapping plates to achieve ultra-flat semiconductor wafer surfaces for fabrication. Classified under HTS 8424.89.9000 for powder/liquid dispersing appliances in wafer processing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 1.8% | +35.0% | 36.8% |
| 🇲🇽Mexico | 1.8% | +10.0% | 11.8% |
| 🇨🇦Canada | 1.8% | +10.0% | 11.8% |
| 🇩🇪Germany | 1.8% | +10.0% | 11.8% |
| 🇯🇵Japan | 1.8% | +10.0% | 11.8% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If grinding/lapping machines for other materials
Lapping machines not specific to semiconductors classify under 8460 for ceramics/stone.
If primarily powder spraying apparatus
Nozzles for spraying powders have dedicated 8424.20 subheading.
If other semiconductor manufacturing machines
Catch-all for semiconductor processing equipment per statistical notes.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Specify nanometer flatness specs in import docs to prove semiconductor application
• Include slurry composition MSDS; chemical classification risks re-route to Chapter 84
Related Products under HTS 8424.89.90.00
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