8424.89.90.00/Wafer Lapping Machine/Mexico

Wafer Lapping Machine from Mexico

Machine that projects abrasive slurry onto rotating lapping plates to achieve ultra-flat semiconductor wafer surfaces for fabrication. Classified under HTS 8424.89.9000 for powder/liquid dispersing appliances in wafer processing.

Duty Rate — Mexico → United States

11.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Specify nanometer flatness specs in import docs to prove semiconductor application

• Include slurry composition MSDS; chemical classification risks re-route to Chapter 84