Silicon Wafer Polishing Slurry Mold
Mold for polishing pads/slurry distribution rings used in final wafer surface preparation for semiconductor fabrication. HTS 8480.49.0090 as other molds for metal carbide polishing equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3.1% | +35.0% | 38.1% |
| 🇲🇽Mexico | 3.1% | +10.0% | 13.1% |
| 🇨🇦Canada | 3.1% | +10.0% | 13.1% |
| 🇩🇪Germany | 3.1% | +10.0% | 13.1% |
| 🇯🇵Japan | 3.1% | +10.0% | 13.1% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If rubber/polymer polishing pad molds
Material of mold construction determines primary classification.
If filtering/separating equipment parts
Slurry handling molds may classify under centrifuge parts.
If imported with polishing compounds
Chemical preparations with molds may trigger compound classification.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Document surface finish specifications (angstrom-level flatness)
• Specify use in chemical mechanical planarization (CMP) tools
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