Edge Grinding Wafer Mold Carrier
Mold carrier system for semiconductor wafer edge grinding to prevent chipping during handling. Falls under HTS 8480.49.0090 as other molds for wafer preparation equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3.1% | +37.5% | 40.6% |
| 🇲🇽Mexico | 3.1% | +10.0% | 13.1% |
| 🇨🇦Canada | 3.1% | +10.0% | 13.1% |
| 🇩🇪Germany | Free | +10.0% | 10% |
| 🇯🇵Japan | Free | +12.5% | 12.5% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If finished semiconductor handling machines
Complete handling equipment supersedes component molds.
If plastic carrier molds
Plastic construction shifts to plastics chapter.
If semiconductor wafer processing parts
General wafer fab parts may use 8479 classification.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Specify edge profile geometries supported
• Include vacuum chuck integration documentation
• Common misclassification as wafer handling robotics
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