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8480.49.00.90/Edge Grinding Wafer Mold Carrier/Mexico

Edge Grinding Wafer Mold Carrier from Mexico

Mold carrier system for semiconductor wafer edge grinding to prevent chipping during handling. Falls under HTS 8480.49.0090 as other molds for wafer preparation equipment.

Duty Rate — Mexico → United States

13.1%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify edge profile geometries supported

• Include vacuum chuck integration documentation

• Common misclassification as wafer handling robotics

Edge Grinding Wafer Mold Carrier from Mexico — Import Duty Rate | HTS 8480.49.00.90