Other
Molding boxes for metal foundry; mold bases; molding patterns; molds for metal (other than ingot molds), metal carbides, glass, mineral materials, rubber or plastics: > Molds for metal or metal carbides: > Other types > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8480.49.00.90
Edge Grinding Wafer Mold Carrier
Mold carrier system for semiconductor wafer edge grinding to prevent chipping during handling. Falls under HTS 8480.49.0090 as other molds for wafer preparation equipment.
Crystal Orientation Mold Fixture
Precision mold fixture for orienting semiconductor crystal boules before slicing to specific crystallographic planes. Classified HTS 8480.49.0090 for wafer manufacturing molds.
SiC Wafer Growth Mold
Mold for silicon carbide (SiC) crystal growth used in power semiconductor wafers. HTS 8480.49.0090 covers metal carbide molds for semiconductor materials processing.
Silicon Ingot Grinding Fixture Mold
Custom mold and fixture for holding silicon crystal ingots during grinding to precise diameters in wafer preparation equipment. HTS 8480.49.0090 covers these as other molds for metal in semiconductor processing.
Semiconductor Crystal Boule Casting Mold
Specialized casting mold for metal carbide crucibles used in semiconductor crystal boule formation processes. Covered under HTS 8480.49.0090 for other molds in wafer manufacturing equipment.
Double-Sided Wafer Grinder Mold
Precision mold for grinding wheels that simultaneously grind both sides of semiconductor wafers to exact thickness. Classified under HTS 8480.49.0090 for wafer grinder molds.
CMP Polishing Head Mold
Mold for chemical mechanical polishing heads used in semiconductor wafer planarization. HTS 8480.49.0090 for metal carbide molds in wafer polishing equipment.
Wafer Thickness Control Mold
Mold system for in-process thickness control during semiconductor wafer grinding/lapping operations. Falls under HTS 8480.49.0090 as other wafer preparation molds.
Sapphire Wafer Substrate Mold
Mold for growing sapphire boules used as substrates for LED/GaN semiconductor wafers. HTS 8480.49.0090 covers metal carbide molds for semiconductor material processing.
Czochralski Crystal Puller Mold Base
A precision mold base used in Czochralski crystal pullers for growing monocrystalline silicon boules in semiconductor wafer manufacturing. It falls under HTS 8480.49.0090 as a mold base for metal or metal carbides specifically designed for semiconductor processing equipment.
Float Zone Crystal Grower Crucible Mold
Mold for crucibles in float zone crystal growers used to produce pure silicon crystals for semiconductor wafers. Classified under HTS 8480.49.0090 as other molds for metal or metal carbides in semiconductor boule production.
Wafer Slicing Saw Blade Mold
Precision mold for manufacturing diamond-impregnated saw blades used to slice semiconductor wafers from silicon boules. Falls under HTS 8480.49.0090 as other molds for metal carbides in wafer manufacturing equipment.
Gallium Arsenide Wafer Lapping Mold Base
Mold base for lapping equipment used to achieve flatness tolerances on GaAs wafers for compound semiconductor fabrication. Classified HTS 8480.49.0090 for metal/metal carbide molds in wafer preparation.
Silicon Wafer Polishing Slurry Mold
Mold for polishing pads/slurry distribution rings used in final wafer surface preparation for semiconductor fabrication. HTS 8480.49.0090 as other molds for metal carbide polishing equipment.
Wire Saw Wafer Cutting Mold Frame
Mold frame for multi-wire saw blades that simultaneously slice hundreds of semiconductor wafers from silicon ingots. HTS 8480.49.0090 for other metal carbide molds in wafer slicing equipment.