Gallium Arsenide Wafer Lapping Mold Base
Mold base for lapping equipment used to achieve flatness tolerances on GaAs wafers for compound semiconductor fabrication. Classified HTS 8480.49.0090 for metal/metal carbide molds in wafer preparation.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3.1% | +35.0% | 38.1% |
| 🇲🇽Mexico | 3.1% | +10.0% | 13.1% |
| 🇨🇦Canada | 3.1% | +10.0% | 13.1% |
| 🇩🇪Germany | 3.1% | +10.0% | 13.1% |
| 🇯🇵Japan | 3.1% | +10.0% | 13.1% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for mineral material lapping (non-semiconductor)
Mineral processing molds separate from semiconductor equipment.
If precision measurement fixtures
Flatness gauging equipment parts go to Chapter 90.
If parts of unclassified semiconductor machines
General semiconductor machine parts may use 8479 provisions.
Not sure which classification is right?
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Import Tips & Compliance
• Reference statistical note coverage for compound semiconductors like GaAs
• Include flatness tolerance specifications in technical docs
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