Semiconductor Crystal Boule Casting Mold
Specialized casting mold for metal carbide crucibles used in semiconductor crystal boule formation processes. Covered under HTS 8480.49.0090 for other molds in wafer manufacturing equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3.1% | +37.5% | 40.6% |
| 🇲🇽Mexico | 3.1% | +10.0% | 13.1% |
| 🇨🇦Canada | 3.1% | +10.0% | 13.1% |
| 🇩🇪Germany | Free | +10.0% | 10% |
| 🇯🇵Japan | Free | +12.5% | 12.5% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If refractory ceramic crucibles
Ceramic products for metal handling in Chapter 69.
If ingot molds (non-semiconductor)
Ingot molds have specific exclusionary subheading.
If parts of crystal growing furnaces
Furnace-specific parts may classify under electric heating equipment.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide thermal shock resistance specifications for classification
• Include foundry qualification certifications
• Avoid 'crucible' terminology - emphasize molding function
Related Products under HTS 8480.49.00.90
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Mold carrier system for semiconductor wafer edge grinding to prevent chipping during handling. Falls under HTS 8480.49.0090 as other molds for wafer preparation equipment.
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Precision mold fixture for orienting semiconductor crystal boules before slicing to specific crystallographic planes. Classified HTS 8480.49.0090 for wafer manufacturing molds.
SiC Wafer Growth Mold
Mold for silicon carbide (SiC) crystal growth used in power semiconductor wafers. HTS 8480.49.0090 covers metal carbide molds for semiconductor materials processing.
Silicon Ingot Grinding Fixture Mold
Custom mold and fixture for holding silicon crystal ingots during grinding to precise diameters in wafer preparation equipment. HTS 8480.49.0090 covers these as other molds for metal in semiconductor processing.
Double-Sided Wafer Grinder Mold
Precision mold for grinding wheels that simultaneously grind both sides of semiconductor wafers to exact thickness. Classified under HTS 8480.49.0090 for wafer grinder molds.
CMP Polishing Head Mold
Mold for chemical mechanical polishing heads used in semiconductor wafer planarization. HTS 8480.49.0090 for metal carbide molds in wafer polishing equipment.