CMP Polishing Head Mold
Mold for chemical mechanical polishing heads used in semiconductor wafer planarization. HTS 8480.49.0090 for metal carbide molds in wafer polishing equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3.1% | +35.0% | 38.1% |
| 🇲🇽Mexico | 3.1% | +10.0% | 13.1% |
| 🇨🇦Canada | 3.1% | +10.0% | 13.1% |
| 🇩🇪Germany | 3.1% | +10.0% | 13.1% |
| 🇯🇵Japan | 3.1% | +10.0% | 13.1% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If filtering/purification equipment
Slurry delivery system parts classify under centrifuges/filters.
If rubber polishing pad molds
Rubber pad manufacturing molds use 8480.60.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Document slurry pressure and pad retention specs
• Reference statistical note wafer polisher coverage
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