CMP Polishing Head Mold from Japan
Mold for chemical mechanical polishing heads used in semiconductor wafer planarization. HTS 8480.49.0090 for metal carbide molds in wafer polishing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document slurry pressure and pad retention specs
• Reference statistical note wafer polisher coverage