CMP Polishing Head Mold from Japan
Mold for chemical mechanical polishing heads used in semiconductor wafer planarization. HTS 8480.49.0090 for metal carbide molds in wafer polishing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document slurry pressure and pad retention specs
• Reference statistical note wafer polisher coverage