8480.49.00.90/CMP Polishing Head Mold/Germany

CMP Polishing Head Mold from Germany

Mold for chemical mechanical polishing heads used in semiconductor wafer planarization. HTS 8480.49.0090 for metal carbide molds in wafer polishing equipment.

Duty Rate — Germany → United States

13.1%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document slurry pressure and pad retention specs

• Reference statistical note wafer polisher coverage

CMP Polishing Head Mold from Germany — Import Duty Rate | HTS 8480.49.00.90