CMP Polishing Head Mold from Germany
Mold for chemical mechanical polishing heads used in semiconductor wafer planarization. HTS 8480.49.0090 for metal carbide molds in wafer polishing equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document slurry pressure and pad retention specs
• Reference statistical note wafer polisher coverage