CMP Polishing Head Mold from Mexico
Mold for chemical mechanical polishing heads used in semiconductor wafer planarization. HTS 8480.49.0090 for metal carbide molds in wafer polishing equipment.
Duty Rate — Mexico → United States
13.1%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document slurry pressure and pad retention specs
• Reference statistical note wafer polisher coverage