Double-Sided Wafer Grinder Mold
Precision mold for grinding wheels that simultaneously grind both sides of semiconductor wafers to exact thickness. Classified under HTS 8480.49.0090 for wafer grinder molds.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3.1% | +35.0% | 38.1% |
| 🇲🇽Mexico | 3.1% | +10.0% | 13.1% |
| 🇨🇦Canada | 3.1% | +10.0% | 13.1% |
| 🇩🇪Germany | 3.1% | +10.0% | 13.1% |
| 🇯🇵Japan | 3.1% | +10.0% | 13.1% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If finished grinding wheels
Millstones/abrasives classify separately from their molds.
If valve/semiconductor process parts
Process equipment parts may use 8481 provisions.
If measuring/controlling thickness
Precision measurement-integrated molds to Chapter 90.
Not sure which classification is right?
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Import Tips & Compliance
• Include thickness tolerance specs (microns)
• Reference statistical note (c)(C) for wafer grinders
• Require carrier/end-effector documentation
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