Double-Sided Wafer Grinder Mold from Germany
Precision mold for grinding wheels that simultaneously grind both sides of semiconductor wafers to exact thickness. Classified under HTS 8480.49.0090 for wafer grinder molds.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include thickness tolerance specs (microns)
• Reference statistical note (c)(C) for wafer grinders
• Require carrier/end-effector documentation