8480.49.00.90/Double-Sided Wafer Grinder Mold/Japan

Double-Sided Wafer Grinder Mold from Japan

Precision mold for grinding wheels that simultaneously grind both sides of semiconductor wafers to exact thickness. Classified under HTS 8480.49.0090 for wafer grinder molds.

Duty Rate — Japan → United States

13.1%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include thickness tolerance specs (microns)

• Reference statistical note (c)(C) for wafer grinders

• Require carrier/end-effector documentation

Double-Sided Wafer Grinder Mold from Japan — Import Duty Rate | HTS 8480.49.00.90