Double-Sided Wafer Grinder Mold from Japan
Precision mold for grinding wheels that simultaneously grind both sides of semiconductor wafers to exact thickness. Classified under HTS 8480.49.0090 for wafer grinder molds.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include thickness tolerance specs (microns)
• Reference statistical note (c)(C) for wafer grinders
• Require carrier/end-effector documentation