8480.49.00.90/Double-Sided Wafer Grinder Mold/Japan

Double-Sided Wafer Grinder Mold from Japan

Precision mold for grinding wheels that simultaneously grind both sides of semiconductor wafers to exact thickness. Classified under HTS 8480.49.0090 for wafer grinder molds.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include thickness tolerance specs (microns)

• Reference statistical note (c)(C) for wafer grinders

• Require carrier/end-effector documentation