CMP Polishing Head Mold from Canada
Mold for chemical mechanical polishing heads used in semiconductor wafer planarization. HTS 8480.49.0090 for metal carbide molds in wafer polishing equipment.
Duty Rate — Canada → United States
13.1%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document slurry pressure and pad retention specs
• Reference statistical note wafer polisher coverage