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8480.49.00.90/Gallium Arsenide Wafer Lapping Mold Base/Japan

Gallium Arsenide Wafer Lapping Mold Base from Japan

Mold base for lapping equipment used to achieve flatness tolerances on GaAs wafers for compound semiconductor fabrication. Classified HTS 8480.49.0090 for metal/metal carbide molds in wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Reference statistical note coverage for compound semiconductors like GaAs

• Include flatness tolerance specifications in technical docs

Gallium Arsenide Wafer Lapping Mold Base from Japan — Import Duty Rate | HTS 8480.49.00.90