Gallium Arsenide Wafer Lapping Mold Base from Mexico
Mold base for lapping equipment used to achieve flatness tolerances on GaAs wafers for compound semiconductor fabrication. Classified HTS 8480.49.0090 for metal/metal carbide molds in wafer preparation.
Duty Rate — Mexico → United States
13.1%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Reference statistical note coverage for compound semiconductors like GaAs
• Include flatness tolerance specifications in technical docs