Gallium Arsenide Wafer Lapping Mold Base from Canada
Mold base for lapping equipment used to achieve flatness tolerances on GaAs wafers for compound semiconductor fabrication. Classified HTS 8480.49.0090 for metal/metal carbide molds in wafer preparation.
Duty Rate — Canada → United States
13.1%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Reference statistical note coverage for compound semiconductors like GaAs
• Include flatness tolerance specifications in technical docs