Wire Saw Wafer Cutting Mold Frame
Mold frame for multi-wire saw blades that simultaneously slice hundreds of semiconductor wafers from silicon ingots. HTS 8480.49.0090 for other metal carbide molds in wafer slicing equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3.1% | +37.5% | 40.6% |
| 🇲🇽Mexico | 3.1% | +10.0% | 13.1% |
| 🇨🇦Canada | 3.1% | +10.0% | 13.1% |
| 🇩🇪Germany | Free | +10.0% | 10% |
| 🇯🇵Japan | Free | +12.5% | 12.5% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If sawing machine parts
Specific sawing machine tooling supersedes general molds.
If finished wire saw blades
Tool classification if imported ready for cutting use.
If metal wire framework only
Plain metal structures without molding function.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Specify wire diameter tolerances and kerf specifications
• Document use in multi-wire saws per statistical note
Related Products under HTS 8480.49.00.90
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