Wire Saw Wafer Cutting Mold Frame from Japan
Mold frame for multi-wire saw blades that simultaneously slice hundreds of semiconductor wafers from silicon ingots. HTS 8480.49.0090 for other metal carbide molds in wafer slicing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify wire diameter tolerances and kerf specifications
• Document use in multi-wire saws per statistical note