Wire Saw Wafer Cutting Mold Frame from Canada
Mold frame for multi-wire saw blades that simultaneously slice hundreds of semiconductor wafers from silicon ingots. HTS 8480.49.0090 for other metal carbide molds in wafer slicing equipment.
Duty Rate — Canada → United States
13.1%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify wire diameter tolerances and kerf specifications
• Document use in multi-wire saws per statistical note