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8480.49.00.90/Wire Saw Wafer Cutting Mold Frame/Mexico

Wire Saw Wafer Cutting Mold Frame from Mexico

Mold frame for multi-wire saw blades that simultaneously slice hundreds of semiconductor wafers from silicon ingots. HTS 8480.49.0090 for other metal carbide molds in wafer slicing equipment.

Duty Rate — Mexico → United States

13.1%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify wire diameter tolerances and kerf specifications

• Document use in multi-wire saws per statistical note

Wire Saw Wafer Cutting Mold Frame from Mexico — Import Duty Rate | HTS 8480.49.00.90