8480.49.00.90/Wire Saw Wafer Cutting Mold Frame/Mexico

Wire Saw Wafer Cutting Mold Frame from Mexico

Mold frame for multi-wire saw blades that simultaneously slice hundreds of semiconductor wafers from silicon ingots. HTS 8480.49.0090 for other metal carbide molds in wafer slicing equipment.

Duty Rate — Mexico → United States

13.1%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify wire diameter tolerances and kerf specifications

• Document use in multi-wire saws per statistical note

Wire Saw Wafer Cutting Mold Frame from Mexico — Import Duty Rate | HTS 8480.49.00.90