Wafer Slicing Saw Blade Mold
Precision mold for manufacturing diamond-impregnated saw blades used to slice semiconductor wafers from silicon boules. Falls under HTS 8480.49.0090 as other molds for metal carbides in wafer manufacturing equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3.1% | +35.0% | 38.1% |
| 🇲🇽Mexico | 3.1% | +10.0% | 13.1% |
| 🇨🇦Canada | 3.1% | +10.0% | 13.1% |
| 🇩🇪Germany | 3.1% | +10.0% | 13.1% |
| 🇯🇵Japan | 3.1% | +10.0% | 13.1% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as finished saw blade rather than mold
Finished metal cutting tools classify separately from their production molds.
If molds for glass wafer processing
Glass/mineral material molds have dedicated subheading.
If parts for sawing/grinding machines
If not primarily a mold, may classify as machine tooling parts.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide evidence of use in wafer slicing saws per statistical note (b)
• Specify carbide substrate materials in import documentation
Related Products under HTS 8480.49.00.90
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