Wafer Slicing Saw Blade Mold
Precision mold for manufacturing diamond-impregnated saw blades used to slice semiconductor wafers from silicon boules. Falls under HTS 8480.49.0090 as other molds for metal carbides in wafer manufacturing equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3.1% | +37.5% | 40.6% |
| 🇲🇽Mexico | 3.1% | +10.0% | 13.1% |
| 🇨🇦Canada | 3.1% | +10.0% | 13.1% |
| 🇩🇪Germany | Free | +10.0% | 10% |
| 🇯🇵Japan | Free | +12.5% | 12.5% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as finished saw blade rather than mold
Finished metal cutting tools classify separately from their production molds.
If molds for glass wafer processing
Glass/mineral material molds have dedicated subheading.
If parts for sawing/grinding machines
If not primarily a mold, may classify as machine tooling parts.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide evidence of use in wafer slicing saws per statistical note (b)
• Specify carbide substrate materials in import documentation
Related Products under HTS 8480.49.00.90
Edge Grinding Wafer Mold Carrier
Mold carrier system for semiconductor wafer edge grinding to prevent chipping during handling. Falls under HTS 8480.49.0090 as other molds for wafer preparation equipment.
Crystal Orientation Mold Fixture
Precision mold fixture for orienting semiconductor crystal boules before slicing to specific crystallographic planes. Classified HTS 8480.49.0090 for wafer manufacturing molds.
SiC Wafer Growth Mold
Mold for silicon carbide (SiC) crystal growth used in power semiconductor wafers. HTS 8480.49.0090 covers metal carbide molds for semiconductor materials processing.
Silicon Ingot Grinding Fixture Mold
Custom mold and fixture for holding silicon crystal ingots during grinding to precise diameters in wafer preparation equipment. HTS 8480.49.0090 covers these as other molds for metal in semiconductor processing.
Semiconductor Crystal Boule Casting Mold
Specialized casting mold for metal carbide crucibles used in semiconductor crystal boule formation processes. Covered under HTS 8480.49.0090 for other molds in wafer manufacturing equipment.
Double-Sided Wafer Grinder Mold
Precision mold for grinding wheels that simultaneously grind both sides of semiconductor wafers to exact thickness. Classified under HTS 8480.49.0090 for wafer grinder molds.