Wafer Slicing Saw Blade Mold from Mexico
Precision mold for manufacturing diamond-impregnated saw blades used to slice semiconductor wafers from silicon boules. Falls under HTS 8480.49.0090 as other molds for metal carbides in wafer manufacturing equipment.
Duty Rate — Mexico → United States
13.1%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide evidence of use in wafer slicing saws per statistical note (b)
• Specify carbide substrate materials in import documentation