8480.49.00.90/Wafer Slicing Saw Blade Mold/Japan

Wafer Slicing Saw Blade Mold from Japan

Precision mold for manufacturing diamond-impregnated saw blades used to slice semiconductor wafers from silicon boules. Falls under HTS 8480.49.0090 as other molds for metal carbides in wafer manufacturing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide evidence of use in wafer slicing saws per statistical note (b)

• Specify carbide substrate materials in import documentation