Other
Parts and accessories suitable for use solely or principally with the machines of headings 8456 to 8465, including work or tool holders, self-opening dieheads, dividing heads and other special attachments for the machines; tool holders for any type of tool for working in the hand: > Other: > For machines of heading 8464: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8466.91.50.00
Polishing Slurry Feed Arm for Wafer Polishers
Robotic arm dispenses slurry evenly across rotating wafer polishers for mirror-finish surfaces. HTS 8466.91.50.00 part for 8464 polishers in wafer manufacturing.
CNC Spindle Cartridge for Wafer Grinding Machines
This high-precision spindle cartridge is designed specifically for CNC wafer grinders used in semiconductor wafer preparation, ensuring ultra-flat surfaces for fabrication. It falls under HTS 8466.91.50.00 as a part for machines of heading 8464, which includes grinding machines tailored for semiconductor processing.
Diamond Grinding Wheel Arbor for Wafer Polishers
A specialized arbor holding diamond-impregnated grinding wheels for semiconductor wafer polishers, achieving nanometer-level flatness. Classified under HTS 8466.91.50.00 for parts of 8464 grinding machines used in wafer lapping and polishing processes.
Coolant Nozzle Assembly for Wafer Saws
Precision nozzle directs coolant to diamond blades in wafer slicing saws, preventing thermal damage to semiconductor material. HTS 8466.91.50.00 for accessories of 8464 sawing machines.
Edge Profiling Tool Holder for Wafer Grinders
Tool holder for edge grinders that profile semiconductor wafers to precise geometries post-slicing. Part of HTS 8466.91.50.00 for heading 8464 wafer prep grinders.
Boule Alignment Fixture for Crystal Slicers
Fixture aligns crystal boules in slicing saws for uniform wafer thickness in semiconductor production. Classified HTS 8466.91.50.00 as special attachment for 8464 machines.
Wafer Chuck Vacuum Plate for Crystal Grinders
Precision vacuum chuck plate secures semiconductor crystal boules during grinding to exact diameters and flats indicating conductivity. It is a part for 8464 grinding machines, thus under HTS 8466.91.50.00 per statistical notes on wafer prep equipment.
Precision Collet for Wafer Slicing Saw Blades
High-accuracy collet holds diamond blades in wafer slicing saws that cut monocrystalline boules into thin wafers. Fits HTS 8466.91.50.00 as an accessory for 8464 sawing/grinding machines in semiconductor wafer manufacturing.
Lapping Plate Dresser for Wafer Lappers
Automated dresser maintains flatness of lapping plates in semiconductor wafer grinders/lappers for dimensional tolerances. Classified in HTS 8466.91.50.00 for other parts of heading 8464 machines described in statistical notes.
Motor Mounting Flange for Float Zone Crystal Pullers
Custom flange mounts rotation motors in float zone crystal pullers/grinders for semiconductor boule preparation. Under HTS 8466.91.50.00 as part for 8464 grinding machines per statistical note (a)(i).