Diamond Grinding Wheel Arbor for Wafer Polishers
A specialized arbor holding diamond-impregnated grinding wheels for semiconductor wafer polishers, achieving nanometer-level flatness. Classified under HTS 8466.91.50.00 for parts of 8464 grinding machines used in wafer lapping and polishing processes.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | Free | +35.0% | 35% |
| š²š½Mexico | Free | +10.0% | 10% |
| šØš¦Canada | Free | +10.0% | 10% |
| š©šŖGermany | Free | +10.0% | 10% |
| šÆšµJapan | Free | +10.0% | 10% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If sold as standalone millstones or grinding wheels
Abrasive wheels without machine-specific mounting shift to Chapter 68 for worked abrasives.
If for heading 8465 metalworking grinders
Parts for 8465 machines (non-semiconductor) use different subheading within 8466.
If for optical flat polishing equipment
Precision polishing for lenses or optics falls under Chapter 90 instruments.
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Import Tips & Compliance
ā¢ Provide evidence of diamond grit specs and wafer tolerance compatibility for correct 8464 attribution
ā¢ Label as 'semiconductor-specific' and include machine model compatibility in commercial invoices
ā¢ Avoid bulk classification errors by distinguishing from general abrasive tool holders
Related Products under HTS 8466.91.50.00
Polishing Slurry Feed Arm for Wafer Polishers
Robotic arm dispenses slurry evenly across rotating wafer polishers for mirror-finish surfaces. HTS 8466.91.50.00 part for 8464 polishers in wafer manufacturing.
CNC Spindle Cartridge for Wafer Grinding Machines
This high-precision spindle cartridge is designed specifically for CNC wafer grinders used in semiconductor wafer preparation, ensuring ultra-flat surfaces for fabrication. It falls under HTS 8466.91.50.00 as a part for machines of heading 8464, which includes grinding machines tailored for semiconductor processing.
Coolant Nozzle Assembly for Wafer Saws
Precision nozzle directs coolant to diamond blades in wafer slicing saws, preventing thermal damage to semiconductor material. HTS 8466.91.50.00 for accessories of 8464 sawing machines.
Edge Profiling Tool Holder for Wafer Grinders
Tool holder for edge grinders that profile semiconductor wafers to precise geometries post-slicing. Part of HTS 8466.91.50.00 for heading 8464 wafer prep grinders.
Boule Alignment Fixture for Crystal Slicers
Fixture aligns crystal boules in slicing saws for uniform wafer thickness in semiconductor production. Classified HTS 8466.91.50.00 as special attachment for 8464 machines.
Wafer Chuck Vacuum Plate for Crystal Grinders
Precision vacuum chuck plate secures semiconductor crystal boules during grinding to exact diameters and flats indicating conductivity. It is a part for 8464 grinding machines, thus under HTS 8466.91.50.00 per statistical notes on wafer prep equipment.