Diamond Grinding Wheel Arbor for Wafer Polishers from Japan
A specialized arbor holding diamond-impregnated grinding wheels for semiconductor wafer polishers, achieving nanometer-level flatness. Classified under HTS 8466.91.50.00 for parts of 8464 grinding machines used in wafer lapping and polishing processes.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide evidence of diamond grit specs and wafer tolerance compatibility for correct 8464 attribution
• Label as 'semiconductor-specific' and include machine model compatibility in commercial invoices
• Avoid bulk classification errors by distinguishing from general abrasive tool holders