CNC Spindle Cartridge for Wafer Grinding Machines
This high-precision spindle cartridge is designed specifically for CNC wafer grinders used in semiconductor wafer preparation, ensuring ultra-flat surfaces for fabrication. It falls under HTS 8466.91.50.00 as a part for machines of heading 8464, which includes grinding machines tailored for semiconductor processing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | Free | +35.0% | 35% |
| š²š½Mexico | Free | +10.0% | 10% |
| šØš¦Canada | Free | +10.0% | 10% |
| š©šŖGermany | Free | +10.0% | 10% |
| šÆšµJapan | Free | +10.0% | 10% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If not exclusively for semiconductor grinding machines
General machinery parts without specific 8464 compatibility fall under Chapter 84 residual provisions.
If integrated with precision measuring for testing
Parts for optical or metrology equipment in semiconductor testing shift to Chapter 90.
If for machines of heading 8465 instead
Heading 8465 covers machine tools for working stone/metals; non-8464 use changes subheading.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
ā¢ Verify the part is exclusively for 8464 grinding machines via manufacturer specs to avoid misclassification
ā¢ Include detailed technical datasheets and end-use certificates for semiconductor processing in documentation
ā¢ Watch for common pitfalls like classifying as general machine tools; specify wafer prep tolerances
Related Products under HTS 8466.91.50.00
Polishing Slurry Feed Arm for Wafer Polishers
Robotic arm dispenses slurry evenly across rotating wafer polishers for mirror-finish surfaces. HTS 8466.91.50.00 part for 8464 polishers in wafer manufacturing.
Diamond Grinding Wheel Arbor for Wafer Polishers
A specialized arbor holding diamond-impregnated grinding wheels for semiconductor wafer polishers, achieving nanometer-level flatness. Classified under HTS 8466.91.50.00 for parts of 8464 grinding machines used in wafer lapping and polishing processes.
Coolant Nozzle Assembly for Wafer Saws
Precision nozzle directs coolant to diamond blades in wafer slicing saws, preventing thermal damage to semiconductor material. HTS 8466.91.50.00 for accessories of 8464 sawing machines.
Edge Profiling Tool Holder for Wafer Grinders
Tool holder for edge grinders that profile semiconductor wafers to precise geometries post-slicing. Part of HTS 8466.91.50.00 for heading 8464 wafer prep grinders.
Boule Alignment Fixture for Crystal Slicers
Fixture aligns crystal boules in slicing saws for uniform wafer thickness in semiconductor production. Classified HTS 8466.91.50.00 as special attachment for 8464 machines.
Wafer Chuck Vacuum Plate for Crystal Grinders
Precision vacuum chuck plate secures semiconductor crystal boules during grinding to exact diameters and flats indicating conductivity. It is a part for 8464 grinding machines, thus under HTS 8466.91.50.00 per statistical notes on wafer prep equipment.