Other
Machinery parts, not containing electrical connectors, insulators, coils, contacts or other electrical features, and not specified or included elsewhere in this chapter: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8487.90.00
Czochralski Crystal Puller Furnace Chamber
The furnace chamber is a critical replaceable part in Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. It provides the high-temperature controlled environment necessary for the pulling process without electrical components. Classified under 8487.90.00 as a machinery part not specified elsewhere in Chapter 84.
Float Zone Crystal Grower Quartz Crucible
High-purity quartz crucible used in float zone crystal growers to contain molten silicon during the zone refining process for semiconductor material production. This non-electrical part maintains material purity at extreme temperatures. Falls under 8487.90.00 as an unspecified machinery part for semiconductor equipment.
Wafer Slicing Diamond Wire Saw Blade
Precision diamond wire saw blade designed specifically for slicing semiconductor boules into thin wafers with minimal material loss. This consumable cutting part lacks electrical features and is essential for wafer preparation equipment. Classified in 8487.90.00 as other machinery parts.
Crystal Boule Grinder Workholding Chuck
Precision workholding chuck for securing semiconductor crystal boules during diameter grinding to wafer specifications. This mechanical part ensures accurate rotation without electrical components. Under 8487.90.00 for unspecified semiconductor grinding machinery parts.
Wafer Lapping Plate
Cast iron or composite lapping plate used in semiconductor wafer grinders/lappers to achieve precise flatness and thickness uniformity on wafer surfaces before fabrication. Purely mechanical surface finishing part without electrical features. Classified 8487.90.00 as other machinery component.
Semiconductor Wafer Polishing Pad
Polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to atomic-level surface finish. This consumable part interfaces with polishing platens in wafer processing equipment. 8487.90.00 for non-electrical machinery parts.
Wafer Handling Vacuum Chuck
Precision vacuum chuck for holding semiconductor wafers during grinding, lapping, and polishing operations without mechanical clamps. Pneumatic-only design excludes electrical connectors. Falls under 8487.90.00 as semiconductor processing machinery part.
Crystal Ingot Trimming Saw Arbor
Rotating arbor assembly that holds diamond saw blades for precision trimming of semiconductor crystal ingot ends before boule processing. Mechanical drive shaft component without electrical features. 8487.90.00 classification for unspecified parts.
Wafer Edge Grinder Collet
Precision collet for securing semiconductor wafers by edge during edge grinding to remove damage layers and achieve exact geometry. Purely mechanical holding fixture. Classified under 8487.90.00 as other machinery part.
Double-Sided Wafer Lapper Ring Carrier
Thin ring carrier that holds multiple semiconductor wafers between upper/lower lapping plates for simultaneous double-sided lapping. Ensures uniform material removal across wafer batch. 8487.90.00 for non-electrical processing parts.
Silicon Boule Flattener Jig
Custom jig fixture for holding semiconductor silicon boules during flat grinding operations that create orientation flats indicating crystal properties. Mechanical alignment tool only. Falls under 8487.90.00 unspecified parts.
Wafer Polisher Slurry Distribution Ring
Perforated ring that evenly distributes chemical slurry across semiconductor wafer surface during polishing operations. Critical for uniform material removal rates. Classified 8487.90.00 as mechanical process part.
Crystal Grinder Coolant Nozzle Assembly
Adjustable nozzle assembly delivering coolant precisely to semiconductor crystal grinding zone to control heat and remove debris. Purely mechanical fluid delivery. 8487.90.00 for process machinery parts.
Wafer Sorter Cassette Adapter Plate
Precision adapter plate aligning FOUP/FOF cassette interfaces with semiconductor wafer sorting/inspection equipment loading stations. Ensures contamination-free wafer transfer. Mechanical alignment part under 8487.90.00.
CMP Polisher Retaining Ring
Consumable retaining ring that contains polishing pad on CMP platen edge while allowing controlled pad wear during semiconductor wafer planarization. Engineered plastic composite part. 8487.90.00 classification.