CMP Polisher Retaining Ring
Consumable retaining ring that contains polishing pad on CMP platen edge while allowing controlled pad wear during semiconductor wafer planarization. Engineered plastic composite part. 8487.90.00 classification.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If generic plastic machine guards/rings
Plastic parts without specific semiconductor function go to Chapter 39.
If installed in complete CMP machine
Complete chemical mechanical polishers are classified as semiconductor equipment.
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Import Tips & Compliance
• Document wear rate specifications and material composition for customs
• Confirm ring design prevents pad edge tearing
• Common misclassification as plastic article under Chapter 39
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