CMP Polisher Retaining Ring from Germany
Consumable retaining ring that contains polishing pad on CMP platen edge while allowing controlled pad wear during semiconductor wafer planarization. Engineered plastic composite part. 8487.90.00 classification.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document wear rate specifications and material composition for customs
• Confirm ring design prevents pad edge tearing
• Common misclassification as plastic article under Chapter 39