Other
Machinery parts, not containing electrical connectors, insulators, coils, contacts or other electrical features, and not specified or included elsewhere in this chapter: > Other > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8487.90.00.80
Czochralski Crystal Puller Crucible
A high-purity graphite or quartz crucible used in Czochralski crystal growers to melt semiconductor materials like silicon for producing monocrystalline boules. It falls under HTS 8487.90.0080 as a specialized part of semiconductor wafer manufacturing machinery, not containing electrical features and not specified elsewhere. This component is essential for the initial growth stage in semiconductor processing.
Semiconductor Wafer Slicing Saw Blade
A diamond-impregnated blade designed for inner-diameter saws that slice ultra-thin wafers from monocrystalline semiconductor boules like silicon. Classified under HTS 8487.90.0080 as a part of wafer preparation machinery in semiconductor manufacturing, lacking electrical features. Ensures precise cuts for subsequent device fabrication.
Crystal Boule Grinder Wheel
Abrasive grinding wheel used in crystal grinders to shape semiconductor boules to exact diameters and grind orientation flats indicating conductivity type. Under HTS 8487.90.0080 as a part for wafer manufacturing preparation equipment in semiconductor processing. Critical for precise boule dimensions before slicing.
Wafer Lapping Plate
Cast iron or ceramic plate used in wafer lappers to achieve flatness tolerances on semiconductor wafers prior to polishing. Classifies in HTS 8487.90.0080 as a component of wafer preparation apparatus for semiconductor device fabrication. Ensures surface planarity critical for lithography processes.
Semiconductor Wafer Polishing Pad
Polyurethane polishing pad for chemical mechanical planarization (CMP) of semiconductor wafers to mirror finish. HTS 8487.90.0080 covers it as a consumable part of wafer polishing machinery in semiconductor fabrication. Removes material uniformly for device layer stacking.
Float Zone Crystal Furnace Heater
RF induction heating coil support (non-electrical) for float zone crystal growth furnaces producing high-purity silicon. Under HTS 8487.90.0080 as mechanical part of semiconductor crystal grower, excluding electrical features. Enables zone melting without crucible contamination.
Wafer Grinding Spindle
Precision spindle assembly for wafer grinders that holds grinding wheels for back-thinning semiconductor wafers to final thickness. HTS 8487.90.0080 as machinery part for semiconductor wafer preparation without electrical connectors. Achieves <50 micron wafer thickness.
Semiconductor Crystal Ingot Holder
Mechanical fixture that secures semiconductor ingots during grinding and slicing operations in wafer manufacturing equipment. Classifies under HTS 8487.90.0080 as non-electrical part not elsewhere specified for semiconductor machinery. Ensures concentricity during processing.
Wafer Edge Grinding Ring
Specialized ring tool for wafer edge grinders that profiles semiconductor wafer edges to prevent chipping during handling. HTS 8487.90.0080 covers as part of semiconductor wafer preparation equipment. Creates chip-resistant rounded edges.
CMP Polishing Head Retaining Ring
Consumable retaining ring for chemical mechanical polishing heads that contains slurry and wafer during planarization. Under HTS 8487.90.0080 as part of semiconductor wafer polishing machinery. Engineered for uniform pressure distribution.
Crystal Grinder Coolant Nozzle
Precision nozzle assembly directing coolant to grinding interface in semiconductor crystal grinders. HTS 8487.90.0080 as machinery part for thermal management in wafer prep equipment. Prevents thermal damage to crystal lattice.
Wafer Slicing Saw Coolant Distributor
Manifold distributing coolant to diamond saw blade during semiconductor wafer slicing from ingots. Classifies HTS 8487.90.0080 as part of wafer manufacturing saws. Maintains blade cooling for thin kerf cuts.
Boule Puller Seed Chuck
Precision chuck holding seed crystal in Czochralski pullers for initiating monocrystalline growth. HTS 8487.90.0080 as mechanical part of semiconductor crystal growing equipment. Ensures proper crystal orientation.
Wafer Polisher Slurry Distributor Arm
Articulating arm delivering chemical slurry uniformly across polishing pad in semiconductor wafer polishers. Under HTS 8487.90.0080 as mechanical part of CMP equipment. Ensures consistent material removal rates.